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Like past Core Ultra generations, the Core Ultra 3 chips use a chiplet-based approach, combining several distinct silicon tiles on a foundational “base tile” using Intel’s Foveros packaging technology. The compute tile houses the CPU cores and the neural processing unit (NPU), and it’s the piece that’s built using 18A—there are two version of this tile, one with a maximum of 16 CPU cores and one with 8. The platform controller tile, which handles most I/O, is still being built at TSMC, as is the high-end 12-core version of the graphics tile. A simpler four-core version of the graphics tile is being made using an older Intel 3 process, which to date has mostly been used for Intel’s Xeon server CPUs.
Intel
Comparing the three different Panther Lake configurations.
Intel
Intel
The 8-core Panther Lake.
Intel
Comparing the three different Panther Lake configurations.
Intel
The 8-core Panther Lake.
Intel
Intel
The 16-core Panther Lake.
Intel
Intel
A version of the 16-core chip with less I/O but a bigger GPU.
Intel
The 16-core Panther Lake.
Intel
A version of the 16-core chip with less I/O but a bigger GPU.
Intel
The chiplet-based approach allows Intel to mix-and-match these tiles to offer three distinct iterations of Panther Lake: the 16-core CPU and the 12-core GPU, the 16-core CPU and the 4-core GPU, and the 8-core CPU and the 4-core GPU. Versions of these chips with some CPU and GPU cores switched off fill out the rest of the Core Ultra Series 3 lineup.
Intel is making big performance claims about the highest-end Core Ultra Series 3 processors: up to 60 percent faster multi-core CPU performance compared to the outgoing Core Ultra 200V chips, and up to 77 percent faster integrated GPU performance. Intel also says a “Lenovo IdeaPad reference design” using a Core Ultra X9 388H was able to stream Netflix at 1080p for 27.1 hours, though how battery life shakes out in real-world laptops is going to vary widely based on other specs and settings.
All Panther Lake chips will also include the same neural processing unit (NPU), capable of up to 50 trillion operations per second (TOPS). This puts it well above the 40 TOPS requirement for Microsoft’s Copilot+ PC label, if a bit short of the 60 TOPS that AMD is claiming for its Ryzen AI 400 series and the 80 TOPS that Qualcomm says its Snapdragon X2 chips are capable of. Wi-Fi 7, Bluetooth 6.0, and up to four Thunderbolt 4 ports round out the most important connectivity features.
It remains to be seen whether Core Ultra Series 3 chips are a turning point for Intel’s fortunes or a temporary rebound in between years of missed deadlines (Panther Lake is a month later than Intel said it would be in October, though by its recent standards that isn’t bad). But their launch later this month suggests that the company’s 18A facilities are up and running, opening the door to the kind of third-party chip manufacturing that former CEO Pat Gelsinger began pursuing nearly five years ago.
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